Ghoneim, M.T., Fahad, H.M., Hussain, A.M., Rojas, J.P., Torres Sevilla, G.A., Alfaraj, N., Lizardo, E.B. and Hussain, M.M., 2015. Enhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channels. AIP Advances, 5(12), p.127115.
Ghoneim, M.T., Fahad, H.M., Hussain, A.M., Rojas, J.P., Torres Sevilla, G.A., Alfaraj, N., Lizardo, E.B. and Hussain, M.M., 2015. Enhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channels. AIP Advances, 5(12), p.127115.
In today's digital world, complementary metal oxide semiconductor (CMOS) technology
enabled scaling of bulk mono-crystalline silicon (100) based electronics has resulted in their
higher performance but with increased dynamic and off-state power consumption. Such
trade-off has caused excessive heat generation which eventually drains the charge of
battery in portable devices. The traditional solution utilizing off-chip fans and heat sinks used
for heat management make the whole system bulky and less mobile. Here we show, an
enhanced cooling phenomenon in ultra-thin (> 10 μm) mono-crystalline (100) silicon
(detached from bulk substrate) by utilizing deterministic pattern of porous network of vertical
“through silicon” micro-air channels that offer remarkable heat and weight management for
ultra-mobile electronics, in a cost effective way with 20× reduction in substrate weight and …